鈦-銅箔層接合電引入裝置中Kovar合金與氧化鋁界面反應

Abstract

本實驗探討利用鈦、銅、鎳等金屬箔片接合電引入裝置中Kovar合金與Al2O3，並檢測漏氣率；金屬箔片組合會影響測漏率，其中以鈦箔與Al2O3相鄰的試片測漏率較佳。將測漏率較佳的試片(Al2O3/Ti/ Cu/Kovar)，以不同溫度但相同的時間來探討生成機構，利用SEM/ TEM觀察Al2O3/Ti/Cu/Kovar反應物之變化。試片經過900oC/0.5hr熱處理之後，在Al2O3/Ti之間形成Ti(Al, O)和Ti3(Cu, Al)3O。而Ti-Cu之間生成TiCu、 Ti2Cu3、TiCu4。Kovar/Cu之間會形成FeTi。950oC時，Al2O3/Ti之間反應形成TiO、Ti3(Cu, Al)3O。而Ti-Cu之間生成Ti2Cu、Ti3Cu4、TiCu2、TiCu4和Cu。在Kovar/Cu界面以Ti-Fe的化合物為主，反應層有FeTi和Fe2Ti，FeTi可溶解銅，形成(Fe, Cu)Ti。1000oC時，Ti-Cu很快生成液相，Al2O3/Ti之間會生成Ti4Cu2O。而Kovar的鐵進入液相參與反應；鐵和銅皆為β-Ti的穩定元素，凝固生成β-Ti(Fe, Cu)；TiCu、(Fe, Cu) Ti是從液相中降溫形成；Kovar/Cu界面形成了兩層連續反應層，分別為(Fe,Cu)Ti和Fe2Ti。

This work presents leak rate of different metal foils(Ti, Cu, Ni) to joint Kovar Alloy-Alumina. The sample (Al2O3/Ti/Cu/Kovar) has the better leak rate. The microstructure of the reaction interface in this sample were characterized using scanning electron microscopy (SEM) and analytical transmission electron microscopy (TEM/EDS). At 900oC, the Ti(Al, O) and Ti3(Cu, Al)3O were formed between Al2O3 and ti foil after bonding process. And TiCu, Ti2Cu3 were formed by ti-cu foils. At the phase at Kovar/Cu interface was FeTi. At 950oC, the TiO, Ti3(Cu, Al)3O were formed at Al2O3/Ti interface. Ti2Cu, Ti3Cu4, TiCu2, TiCu4, Cu were formed by ti-cu foils. The interlayers of (Fe, Cu)Ti and Fe2Ti were formed between Kovar and cu foil. At high Temperature 1000◦C, Ti4Cu2O was formed by Ti-rich solution. And β-Ti(Fe, Cu), TiCu, (Fe, Cu)Ti were formed by ti, cu and fe elements. And the interlayers of (Fe, Cu)Ti and Fe2Ti were formed between Kovar and cu foil.