使用壓縮空氣噴流分離矽晶片研究

Abstract

在太陽能矽晶片的生產過程中，必須將細薄而且互相黏附的半成品分離取出，為了避免硬脆的矽晶片破裂，使用噴流吹入矽晶片之間的縫隙將其吹離，再搭配取放機構將矽晶片取走。 目前產業界評估、設計此裝置仍然使用試誤法，並沒有定義一套可考靠性較高的設計法則，品質不足以讓人信賴，本文以數值模擬搭配實驗方法建立可靠的設計法則。 實驗的流程可概分為三個階段，第一階段定義實驗參數做為控制變因，在此架構下建立模型與參數的相關性；第二階段使用數值模擬對流場做初步的驗證，並且將不適用的參數排除；第三階段將上述兩階段的結果整合，進行一系列的實驗。 研究的結果顯示，流場模擬可以預測吹離矽晶片於穩態時流場的紊流特性，而實驗結果可發現，若是需要快速的分離矽晶片，應該使用較少的噴嘴數量，但是在生產更薄的產品時，噴流的應力將造成晶片破裂，必須增加噴嘴數量以及角度著手，在生產更大尺寸晶片時，考量的是振動產生破裂，加速度成為關鍵的測量值，將噴嘴與晶片成65度角並且為雙對噴嘴，流體壓力設定為3.5kg/cm2表現為最佳。

During the production process for solar energy silicon chips, thin and sticking semi-finished products must be separated and extracted. To prevent the brittle silicon chips from rupturing, a jet stream is blown into the gaps between the chips to keep them separated, and a fetching structure is used to move or remove the silicon chips. Current industry assessments and designs for this device remain based on the trial-and-error method. No reliable design rules have been defined and the quality of the products is not dependable. For this study, we employed numerical simulation with experimental methods to establish reliable design rules. The experimental process can be divided into three stages. In the first stage, the experimental parameters were defined as control variables and the correlation between the model and the parameters under this framework was established. In the second stage, the researcher used the numerical simulation to conduct preliminary validation of the flow field and eliminate the inappropriate parameters. In the third stage, the results of the first two stages were combined and used to conduct a series of experiments. The results of this study indicated that the flow field simulation can predict the turbulence characteristics of a silicon chip blowing operation for a steady-state flow field. The experiment results show that fewer nozzles should be used for rapid separation of the silicon chips. However, the jet stress would rupture thinner chips. Therefore, additional nozzles should be used to produce thinner chips. Vibration rupture should be considered during large size silicon chip production. Acceleration is the key measurement value for this situation. Two pairs of nozzles positioned at 65° to the silicon chip with the fluid pressure set to 3.5kg/cm2 provides the optimum performance results.