光學微透鏡陣列熱壓成形技術之研究

Abstract

本研究使用超精密加工在無電解鎳材料上製作微透鏡陣列結構，其中微透鏡陣列之尺寸為8.7μm深、180μm寬、透鏡間之間距為320μm。並選用1 mm厚之聚甲基丙烯酸甲酯（俗稱壓克力，PMMA）板材作為微熱壓成形材料，本研究針對不同成形條件對微透鏡陣列的影響，包括透鏡長度、寬度與深度，以3D雷射共軛焦顯微鏡量測分析，最後得出最佳製程參數。研究結果發現，熱壓溫度與熱壓力量為影響元件成形轉寫率之重要關鍵參數。當溫度160℃時，微透鏡陣列轉寫率隨熱壓力量上升而增加，且在1.0 kN達到飽和值。最後本研究在熱壓溫度160℃、熱壓力量1.0 kN下完成高度8.512μm、轉寫率98.27％的微透鏡陣列。

This study uses ultra-precision machining production of micro-lens array structure in the absence of electroless nickel materials. The size of the microlens array is 8.7μm deep, 180μm wide, and the spacing between the lens are 320μm. And choice 1 mm thick of Poly methyl-methacrylate (Commonly known as PMMA) sheet as a micro hot embossing material. This study for different conditions on the microlens array, including the lens length, width and depth of 3D laser confocal microscopy measured the conclusion that the best process parameters. We found that hot embossing temperature and force are the key parameters of the components transcription rate. When the temperature of 160℃, the microlens array and transcription rate increased with hot embossing forces increase and reach the saturation value of 1.0 kN. Finally, the hot embossing temperature under 160℃,force 1.0kN complete height 8.512μm、transcription rate 98.27% of the microlens array.