标题: 利用四氟化碳电浆处理于多晶矽及氮电浆处理于二氧化铪闸极介电层之低温多晶矽薄膜电晶体之研究
The Study of LTPS-TFTs with CF4 plasma pre-treated poly-silicon and N2 plasma post-treated HfO2 Gate Dielectric Layer
作者: 黄柏文
Huang, Bo-Wen
张国明
Chang, Kow-Ming
电子研究所
关键字: 双重电浆处理;低温多晶矽薄膜电晶体;Dual plasma treatment;LTPS-TFTs
公开日期: 2011
摘要: 近年来低温多晶矽薄膜电晶体由于在主动阵列显示器的应用而吸引很多注意,然而莫尔定律通常限制于微影技术,越小的线宽需要更更短波长的光源,因此很难一直永远微缩下去。当闸极氧化层非常薄而小于1.4奈米时会由于直接穿隧的漏电而造成不可避免的闸极漏电流。因此近年来高介电常数的物质常常被广泛应用在闸极材料上,进而提升它的闸极品质而降低漏电流。在众多高介电常数的材料当中,二氧化铪有高介电常数(25-30)、足够大的能带而且和多晶矽有很好的热稳定性等优点,因此二氧化铪被认定为是最有前瞻性高介电常数材料。实验中,我们将二氧化铪用在低温多晶矽薄膜电晶体上当作是对照组,而再外加由四氟化碳电浆的前处理和氮电浆的后处理作为观察组(我们称双重电浆处理)。我们不仅讨论二氧化铪用于低温多晶矽薄膜电晶体的基本电性外,更进一步深入探讨可靠度的问题,例如: 闸极正偏压应力、闸极正偏压应力高温应力、闸极负偏压应力和热载子效应。而在结果中不管是用哪一种方法量测二氧化铪用于低温多晶矽薄膜电晶体的可靠度,双重电浆处理的观察组皆比没电浆处理的对照组特性要好,原因可能是四氟化碳电浆的前处理可以修补介面品质而氮电浆的后处理可以修补二氧化铪闸极的内部缺陷。
In recent years, high performance low-temperature polycrystalline-silicon thin-film transistors (LTPS-TFTs) have been attracted much attention due to the increasing applications in active matrix display (AMLCDs). However, the scaling to Moore’s law are limited to the lithography, the more minimum feature size as we need to pattern, the shorter wavelengths of light we must to achieve, so it is impossible to scale down forever. It is terrible that gate oxide is so thin (1.4 nm) which caused an intolerable gate leakage due to direct tunneling current. Therefore, high-k gate dielectric material has been extensively studied in recent year, which could effectively reduce leakage current and improve device performance. There are many high-k dielectric materials had been used before, hafnium oxide (HfO2) is considered one of the promising high-k gate material due to its high permittivity (25-30), wide energy bandgap and thermal stability with poly-Si. The HfO2 LTPS-TFTs were used as without treatment sample and combined with dual plasma treatment because of the combination of pre-deposition plasma fluorination and post-deposition plasma nitridation. We discussed not only the basic electrical characteristics but also reliability properties such as positive-bias stress instability (PBI), positive-bias temperature instability (PBTI), negative-bias stress instability (NBI) and hot carrier stress (HCS). No matter how the stress mechanism applies, the dual plasma treatment LTPS-TFTs exhibits a superior performance than without treatment. It might be that fluorine incorporation can improve the interface quality and nitrogen also can repair defects at bulk dielectric to decrease the leakage current.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT079911564
http://hdl.handle.net/11536/49111
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