分離式熱源對微通道熱沉的熱特性

Abstract

在電子散熱中，避免結合點溫度過高，可減少電子元件進入功能減衰，保證電子元件的穩定，隨者電子元件的發展，發熱源有往分離式熱源且熱源集中的趨勢，故熱沉的設計，變得相當重要。 微通道為一種液冷式的熱沉，本研究設計不同尺寸的微通道，藉由模擬數值分析與實驗數據對比，研究微通道在發熱源為均勻和發熱源為分離式下的熱特性，在模擬數值分析中，探討在不同歧管設計與微通道流道設計下，加熱面的溫度分布包含平均溫度與最高溫度，與微通道的進出口壓降，以及將微通道的流道進行分流設計後，流道的流量分布和工作流體溫度分布；實驗分析中，探討加熱源與微通道接觸面的平均溫度和最高溫度，以及微通道進出口的壓降，受到不同加熱源和歧管影響下的變化。 微通道系統，主要熱傳機制為熱對流效應，增加熱對流效應，可以明顯的加強微通道的熱特性，次要為熱傳導效應。隨者加熱瓦數的增加，加熱面的溫度分布會越來越不均勻，當熱源為分離式熱源，發熱量集中，加熱面會有較大的結合點溫度，可透過微通道設計，降低最高溫度，避免加熱源的損壞。

In electronics cooling, the junction temperature must be kept as low as possible to ensure the safe operation and stability of the electronic components. The problem becomes more severe since the electronic components always has discrete and concentrated heat source feature that accentuates the associated phenomenon. Therefore, microchannel employing liquid cooling is a good solution to eliminate the gigantic heat resistance caused by high flux concentrated heat sources. This study investigates the effect of configuration for microchannel heat sink on the overall performance both experimentally and numerically. The influence of the configurations of the manifolds is also examined. It is found that the forced convection is the main heat transfer mechanism but thermal conduction effect also plays essential role. The temperature distribution of the heat source becomes more non-uniform when the supplied heat is increased. To examine the influence of discrete heat source, the supplied heat source is divided into three separate heating sources. The results show a significant effect of the concentrated heat source. It is found that the deviation of temperature is also related to the supplied heat and the location of supplied heat source.