台灣晶圓代工業八吋晶圓產能在後摩爾定律時代的發展策略研究- 以個案公司為例

Abstract

台灣擁有完整的半導體產業供應鏈，其中以專業晶圓代工產業的發展最為成功，其創新的商業模式徹底改變半導體產業的結構與生態，二十五年來憑藉著成功的市場定位與發展策略讓台灣的晶圓代工產業在技術及產值上均位居全球晶圓代工產業的領導地位。

然隨著半導體技術發展逐漸迫近物理極限亦即進入所謂的後摩爾定律時代以及終 端運用產品出現典範轉移之際，半導體產業的競爭態勢起了極大的變化，近年來越來越多擅長於不同半導體領域的廠商競相投入專業晶圓代工產業，台灣的晶圓代工產業將面臨不同以往的挑戰與競爭。在十二吋晶圓先進技術產品的競爭上必須克服製程發展迫近物理極限的障礙同時面對世界最頂尖半導體製造公司投入晶圓代工產業的競爭，而在八吋晶圓製程部分則需因應主流產品轉入十二吋產線造成產品線空缺的挑戰之餘同時面對大量的記憶體或整合元件製造商將其八吋成熟產能轉入晶圓代工產業的挑戰。

本研究旨在探討晶圓代工產業生態丕變之際，台灣現有的晶圓代工業者的成熟製程八吋晶圓廠所採用的營運策略，並對其為來可能的發展方向與做出建議。

Wafer foundry industry is one of the most success segments among Twain’s completed semiconductor supply chain. The innovated business model launched in Taiwan had re-structured semiconductor industry’s structure. It was correct market positioning and developing strategy that made Taiwan’s foundry companies lead at not just worldwide marker cap but also technology readiness.

There is significant change in semiconductor industry in terms of competition strategy as facing post-Moor’s law era and consumer product’s paradigm shift . New competitors from various semiconductor segments made their move toward wafer foundry in past years. The more competitors the more challenge for Taiwan’s foundry companies to sustain their advantage. We can foresee that in 300mm advanced technology foundry market, Taiwan foundry player will struggle at not only overcome the technical difficulty while approaching the end of Moor’s law but also face the competition from most success semiconductor companies in the world such as Samsung and Intel. As to the 200mm matured technology foundry market, they must deal with not only the idle capacity invited by major products migrating to 300mm Fab but also the competition from other new comers who were originally focus on memory manufacturing or IDM.

This research attempts to summarize how Taiwan wafer foundry players’ 200mm Fab react to the challenge brought by new competitors in the post-Moor’s law era.