冷卻速率對銲錫凸塊之微硬度和接觸電阻的影響及無電鍍鎳對鋁墊打線接合的影響

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	鄭仁鈞	en_US
dc.contributor.author	邱碧秀	en_US
dc.date.accessioned	2014-12-12T02:03:05Z	-
dc.date.available	2014-12-12T02:03:05Z	-
dc.date.issued	1984	en_US
dc.identifier.uri	http://140.113.39.130/cdrfb3/record/nctu/#NT732428007	en_US
dc.identifier.uri	http://hdl.handle.net/11536/52026	-
dc.language.iso	en_US	en_US
dc.title	冷卻速率對銲錫凸塊之微硬度和接觸電阻的影響及無電鍍鎳對鋁墊打線接合的影響	zh_TW
dc.title	Effects of cooling rate on microhardness and contact resistance of solder bumps and electroless Ni plating on wire bonding of Al pads	en_US
dc.type	Thesis	en_US
dc.contributor.department	電子研究所	zh_TW
顯示於類別：	畢業論文