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dc.contributor.authorPeng, Tai-Yenen_US
dc.contributor.authorLo, C. K.en_US
dc.contributor.authorChen, San-Yuanen_US
dc.contributor.authorYao, Y. D.en_US
dc.date.accessioned2014-12-08T15:06:40Z-
dc.date.available2014-12-08T15:06:40Z-
dc.date.issued2007-02-01en_US
dc.identifier.issn0018-9464en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TMAG.2006.888497en_US
dc.identifier.urihttp://hdl.handle.net/11536/5223-
dc.description.abstractThe structural and exchange bias properties of CoFe/IrMn prepared on Si (100) and Si (111) with an Os/Cu buffer layer were investigated. Since the Os (0002) surface mesh has the same atomic arrangement as fcc (111) orientation, and the lattice mismatch between Os (0002) and IrMn (111) is as low as 2.6%, the CoFe/IrMn grown on H-Si(100) showed a strong IrMn (111) diffraction peak, while a very weak IrMn (111) peak appeared on H-Si (111). With increasing Os thickness (d(Os)), the IrMn (200) peak was weakened, while the IrMn (111) became strong on H-Si (100). For the CoFe/IrMn grown on H-Si(111), no obvious structural change appeared. Os plays an important role on tuning the IrMn to result in the exchange bias. On the other hand, CoFe/IrMn showed an exchange field (H-ex) on both H-Si(100) and H-Si(111) with the Os buffer layer; however, the magnetization switching process was different due to different the crystalline degree. A sharp magnetization switching process occurs for IrMn(111) on Os/Cu/H-Si(100) with a square hysteresis loop. A 370 and 310 Oe of H-ex was found in textured CoFe/TrMn on Os/Cu/H-Si(100) and Os/Cu/H-Si(111), respectively.en_US
dc.language.isoen_USen_US
dc.subjectbuffer layeren_US
dc.subjectosmiumen_US
dc.subjecttextured filmen_US
dc.titleEffects of an Os buffer layer on structure and exchange bias properties of CoFe/IrMn fabricated on Si(100) and Si(111)en_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1109/TMAG.2006.888497en_US
dc.identifier.journalIEEE TRANSACTIONS ON MAGNETICSen_US
dc.citation.volume43en_US
dc.citation.issue2en_US
dc.citation.spage894en_US
dc.citation.epage896en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000244011300068-
Appears in Collections:Conferences Paper


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