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dc.contributor.authorDai, Chih-Haoen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorChu, Ann-Kuoen_US
dc.contributor.authorKuo, Yuan-Juien_US
dc.contributor.authorChen, Shih-Chingen_US
dc.contributor.authorTsai, Chih-Tsungen_US
dc.contributor.authorLo, Wen-Hungen_US
dc.contributor.authorHo, Szu-Hanen_US
dc.contributor.authorXia, Guangruien_US
dc.contributor.authorCheng, Osberten_US
dc.contributor.authorHuang, Cheng Tungen_US
dc.date.accessioned2014-12-08T15:06:49Z-
dc.date.available2014-12-08T15:06:49Z-
dc.date.issued2010-11-25en_US
dc.identifier.issn0257-8972en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.surfcoat.2010.07.028en_US
dc.identifier.urihttp://hdl.handle.net/11536/5345-
dc.description.abstractThe influence of tensile mechanical strain on gate-induced floating-body effect (GIFBE) in advanced partially depleted SOI n-MOSFETs was investigated. Both drain current and mobility enhance after applying strain due to the reduction of average transfer effective mass. However, it was found that the GIFBE becomes serious under the mechanical strain. To explain this phenomenon, we first clarify the mechanism of GIFBE using different operation conditions. The experiment results indicate that the GIFBE can be attributed to the anode hole injection (AHI) rather than the widely accepted mechanism of electron band (EVB) tunneling. Based on the AHI model, the enhanced GIFBE under the mechanical strain is mainly due to the narrowing of band gap induced by the strain in the poly-gate. (C) 2010 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectSOIen_US
dc.subjectGIFBEen_US
dc.subjectElectron-valance band tunnelingen_US
dc.subjectStrained siliconen_US
dc.titleEnhanced gate-induced floating-body effect in PD SOI MOSFET under external mechanical strainen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.surfcoat.2010.07.028en_US
dc.identifier.journalSURFACE & COATINGS TECHNOLOGYen_US
dc.citation.volume205en_US
dc.citation.issue5en_US
dc.citation.spage1470en_US
dc.citation.epage1474en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000285487700052-
Appears in Collections:Conferences Paper


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