Effects of current crowding and Joule heating on reliability of solder joints

Title:	Effects of current crowding and Joule heating on reliability of solder joints
Authors:	Liang, S. W. Chiu, S. H. Chen, Chih 材料科學與工程學系 Department of Materials Science and Engineering
Keywords:	electromigration;flip-chip solder joints;Joule heating
Issue Date:	2007
Abstract:	This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration.
URI:	http://hdl.handle.net/11536/5346
ISBN:	978-0-7354-0459-5
ISSN:	0094-243X
Journal:	STRESS-INDUCED PHENOMENA IN METALLIZATION
Volume:	945
Begin Page:	180
End Page:	193
Appears in Collections:	Conferences Paper