| 标题: | Effects of current crowding and Joule heating on reliability of solder joints |
| 作者: | Liang, S. W. Chiu, S. H. Chen, Chih 材料科学与工程学系 Department of Materials Science and Engineering |
| 关键字: | electromigration;flip-chip solder joints;Joule heating |
| 公开日期: | 2007 |
| 摘要: | This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration. |
| URI: | http://hdl.handle.net/11536/5346 |
| ISBN: | 978-0-7354-0459-5 |
| ISSN: | 0094-243X |
| 期刊: | STRESS-INDUCED PHENOMENA IN METALLIZATION |
| Volume: | 945 |
| 起始页: | 180 |
| 结束页: | 193 |
| 显示于类别： | Conferences Paper |
- 覆晶焊锡接点在通电下焦耳热效应及热迁移之研究 / 萧翔耀;Hsiao, Hsiang-Yao;陈智;Chen, Chih
- Relieving hot-spot temperature during electromigration in solder and current crowding effects bumps by using Cu columns / Liang, S. W.;Chang, Y. W.;Chen, Chih
- Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration / Liang, SW;Chang, YW;Chen, C
- INVESTIGATION OF JOULE HEATING EFFECT IN VARIOUS STAGES OF FAILURE IN FLIP-CHIP SOLDER JOINTS UNDER ACCELERATED ELECTROMIGRATION / Hsiao, Hsiang Yao;Chen, Chih;Yao, D. J.
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