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dc.contributor.authorFeng, Li-Weien_US
dc.contributor.authorChang, Chun-Yenen_US
dc.contributor.authorChang, Yao-Fengen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorWang, Shin-Yuanen_US
dc.contributor.authorChen, Shih-Chingen_US
dc.contributor.authorLin, Chao-Chengen_US
dc.contributor.authorChen, Shih-Chengen_US
dc.contributor.authorChiang, Pei-Weien_US
dc.date.accessioned2014-12-08T15:06:53Z-
dc.date.available2014-12-08T15:06:53Z-
dc.date.issued2010-05-31en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.3428777en_US
dc.identifier.urihttp://hdl.handle.net/11536/5384-
dc.description.abstractIn this paper, the influence of a 600 degrees C rapid thermal annealing for 60 s on the improvements of resistance switching behaviors in a TiN/SiO(2)/FeO(x)/FePt structure is reported. It is found that besides the distinct reduction in memory switching parameters in forming voltage, set/reset voltages, and their dispersions, the resistance ratio of high-resistance state to low-resistance state is also enlarged after annealing. The effects of annealing on improving the resistance switching properties are discussed by x-ray diffraction and x-ray photon-emission spectra depth profile results. Additionally, good retention characteristics are exhibited in the annealed TiN/SiO(2)/FeO(x)/FePt resistance switching memory. (C) 2010 American Institute of Physics. [doi:10.1063/1.3428777]en_US
dc.language.isoen_USen_US
dc.titleImprovement of resistance switching characteristics in a thin FeO(x) transition layer of TiN/SiO(2)/FeO(x)/FePt structure by rapid annealingen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.3428777en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume96en_US
dc.citation.issue22en_US
dc.citation.spageen_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
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