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dc.contributor.authorDeng, Dongmeien_US
dc.contributor.authorYu, Naisenen_US
dc.contributor.authorWang, Yongen_US
dc.contributor.authorZou, Xinboen_US
dc.contributor.authorKuo, Hao-Chungen_US
dc.contributor.authorChen, Pengen_US
dc.contributor.authorLau, Kei Mayen_US
dc.date.accessioned2014-12-08T15:06:54Z-
dc.date.available2014-12-08T15:06:54Z-
dc.date.issued2010-05-17en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.3427438en_US
dc.identifier.urihttp://hdl.handle.net/11536/5398-
dc.description.abstractInGaN-based light-emitting diodes (LEDs) were grown and fabricated on nanoscale patterned Si (111) substrates (NPSi). Using anodized aluminum oxide as the etch mask, the NPSi was prepared with an average nanopore diameter of 150 nm and interpore distance of 120 nm. LEDs grown on NPSi exhibit relaxed tensile stress relative to the ones grown on microscale patterned Si (111) substrates (MPSi). Nanoheteroepitaxial lateral overgrowth was significantly promoted on NPSi, which led to extensive dislocation bending and annihilation. The devices made on NPSi exhibit lower leakage current and higher light output power as compared with those on MPSi. (C) 2010 American Institute of Physics. [doi: 10.1063/1.3427438]en_US
dc.language.isoen_USen_US
dc.titleInGaN-based light-emitting diodes grown and fabricated on nanopatterned Si substratesen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.3427438en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume96en_US
dc.citation.issue20en_US
dc.citation.epageen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000277969700006-
dc.citation.woscount13-
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