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dc.contributor.authorKu, Ching-Shunen_US
dc.contributor.authorLee, Hsin-Yien_US
dc.contributor.authorHuang, Jheng-Mingen_US
dc.contributor.authorLin, Chih-Mingen_US
dc.date.accessioned2014-12-08T15:07:02Z-
dc.date.available2014-12-08T15:07:02Z-
dc.date.issued2010-04-15en_US
dc.identifier.issn0254-0584en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.matchemphys.2009.12.028en_US
dc.identifier.urihttp://hdl.handle.net/11536/5511-
dc.description.abstractThin crystalline films of zinc oxide (ZnO) of high quality have been grown epitaxially on a (0 0 0 1) c-plane of a sapphire substrate with atomic layer deposition (ALD) at extra-low temperature. With diethylzinc (DEZn) and deionized water as precursors in combination with interrupted flow, we obtained ZnO thin films with an optimal growth window in a range 25-160 degrees C, so effectively lowering the growth temperature by about 120 degrees C relative to the conventional method involving a continuous-flow. We characterized the microstructure of these films with X-ray reflectivity and high-resolution X-ray diffraction (XRD) measurements. The XRD results indicate that the stock time might extend the reaction of DEZn and water through an increased duration. This low temperature for growth results in increased crystalline quality and reduced the non-radiative recombination process to enhance the optical properties of ZnO films. (c) 2009 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectZnOen_US
dc.subjectAtomic layer depositionen_US
dc.subjectFlow-rate interruptionen_US
dc.subjectX-ray diffractionen_US
dc.titleEpitaxial growth of ZnO films at extremely low temperature by atomic layer deposition with interrupted flowen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.matchemphys.2009.12.028en_US
dc.identifier.journalMATERIALS CHEMISTRY AND PHYSICSen_US
dc.citation.volume120en_US
dc.citation.issue2-3en_US
dc.citation.spage236en_US
dc.citation.epage239en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000276984600002-
dc.citation.woscount8-
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