完整後設資料紀錄
DC 欄位語言
dc.contributor.authorLee, Yu-Hueien_US
dc.contributor.authorYang, Yao-Yien_US
dc.contributor.authorChen, Ke-Horngen_US
dc.contributor.authorLin, Ying-Hsien_US
dc.contributor.authorWang, Shih-Jungen_US
dc.contributor.authorZheng, Kuo-Linen_US
dc.contributor.authorChen, Po-Fungen_US
dc.contributor.authorHsieh, Chun-Yuen_US
dc.contributor.authorKe, Yu-Zhouen_US
dc.contributor.authorChen, Yi-Kuangen_US
dc.contributor.authorHuang, Chen-Chihen_US
dc.date.accessioned2014-12-08T15:07:20Z-
dc.date.available2014-12-08T15:07:20Z-
dc.date.issued2010-11-01en_US
dc.identifier.issn0018-9200en_US
dc.identifier.urihttp://dx.doi.org/10.1109/JSSC.2010.2063610en_US
dc.identifier.urihttp://hdl.handle.net/11536/5790-
dc.description.abstractThe proposed power management module with a typical 1.2 V low-voltage PWM (LV-PWM) controller and dynamic voltage scaling (DVS) function is designed using 65 nm technology for integration with the ultra-wide band (UWB) system. The on-chip pre-regulator with a power conditioning circuit can provide a regulated supply voltage to the LV-controller. Moreover, the proposed handover technique can achieve the self-biasing mechanism to further reduce power dissipation. To operate in low voltage, the proposed compensation enhancement multistage amplifier (CEMA) can achieve high loop gain and ensure system stability without using any external compensation component. The fabricated power management module occupies 0.356 mm(2) silicon area with an excellent line/load transient response. Owing to the DVS function, the proposed power management can meet the power requirement in the UWB system and other RF transceiver systems.en_US
dc.language.isoen_USen_US
dc.subjectDC-DC converteren_US
dc.subjectdynamic voltage scalingen_US
dc.subjectlow-voltage operationen_US
dc.subjectpower conversion efficiencyen_US
dc.subjectpower managementen_US
dc.subjecttransient responseen_US
dc.subjectUWB systemen_US
dc.titleA DVS Embedded Power Management for High Efficiency Integrated SoC in UWB Systemen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1109/JSSC.2010.2063610en_US
dc.identifier.journalIEEE JOURNAL OF SOLID-STATE CIRCUITSen_US
dc.citation.volume45en_US
dc.citation.issue11en_US
dc.citation.spage2227en_US
dc.citation.epage2238en_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.identifier.wosnumberWOS:000283442500003-
顯示於類別:會議論文


文件中的檔案:

  1. 000283442500003.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。