標題: 次微米元件中因熱載子入射引發之可靠度問題之物理、模擬與量測
Physics, simulation and characterization of hot carrier injection induced reliability issues in submicron MOSFET's
作者: 黃智睦
Huang, Zhi Mu
汪大暉
Wang, Da Hui
電子研究所
公開日期: 1993
URI: http://140.113.39.130/cdrfb3/record/nctu/#NT822430015
http://hdl.handle.net/11536/58528
顯示於類別:畢業論文