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dc.contributor.authorLiao, Lun-Deen_US
dc.contributor.authorChao, Paul C-Pen_US
dc.contributor.authorHuang, Chih-Weien_US
dc.contributor.authorChiu, Chi-Weien_US
dc.date.accessioned2014-12-08T15:07:30Z-
dc.date.available2014-12-08T15:07:30Z-
dc.date.issued2010-02-01en_US
dc.identifier.issn0960-1317en_US
dc.identifier.urihttp://dx.doi.org/10.1088/0960-1317/20/2/025013en_US
dc.identifier.urihttp://hdl.handle.net/11536/5904-
dc.description.abstractThis study develops a continuous model to analyze the 'pull-in' effect in the circular micro-plates used in capacitive-type micro-electro-mechanical systems (MEMS) sensors, actuators and microphones. In developing the model, the governing equation of motion of the deformed plate is established in the form of a partial different equation (PDE) which is then decomposed using the Galerkin method to create a coupled set of modal ordinary differential equations. By considering the first-order deflection mode only and using a fifth-order Taylor series expansion of the electrostatic force, closed-form solutions are obtained for both the position and the voltage of the static pull-in event. Applying an energy balance method and a finite-order approximation method, the solutions are then obtained for the position and voltage of the dynamic pull-in event. The theoretical results obtained for the pull-in phenomena are verified based on the comparison to available experimental data, and also numerically using a finite element analysis (FEA) approach. In general, the results indicate that the ratio of the dynamic to static pull-in voltages is approximately 92%. However, when the squeezed-film effect induced by the air gap between the two plates is taken into account, the value of this ratio increases slightly as a result of considering a higher dynamic pull-in voltage.en_US
dc.language.isoen_USen_US
dc.titledc dynamic and static pull-in predictions and analysis for electrostatically actuated clamped circular micro-plates based on a continuous modelen_US
dc.typeArticleen_US
dc.identifier.doi10.1088/0960-1317/20/2/025013en_US
dc.identifier.journalJOURNAL OF MICROMECHANICS AND MICROENGINEERINGen_US
dc.citation.volume20en_US
dc.citation.issue2en_US
dc.citation.epageen_US
dc.contributor.department影像與生醫光電研究所zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentInstitute of Imaging and Biomedical Photonicsen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000275331200015-
dc.citation.woscount6-
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