晶粒表面缺陷的檢測系統

Abstract

我們發展了一個晶粒表面缺檢測系統。這個系統可以自動的檢測晶圓上每 個晶粒表面缺陷。這個系統含有三個部份：1.影像擷取, 2. 影像前處 理, 3.缺陷檢測。一個晶粒分成鋁黃、作用區、保護區三個部份。在鋁黃 部份可能出現之缺陷為異常覆蓋物,在作用區內可能出現之缺陷有污點、 刮傷,保護區部份可能出現之缺陷有刮傷、斷裂。每一晶粒的這三個部份 依序的被檢測。良品必須通過這三個部份的檢測。否則, 若某一部份沒有 通過檢測標準則視為不良品,且不再做下一部份之檢測。 實驗結果顯示良 品檢測率可達到99.21%,不良檢測率可達到90.48%。檢測時間,一個晶粒平 均要花大約6327.5ms。 An image inspection system for detecting defects on chip is developed. The system can automatically inspect defects of chips on wafer after operator's alignment.The system consists of three parts: 1. image acquisition, 2. image preprocessing, 3. defect detection. A chip to be inspected has three parts which are bonding pad, active region, and edge region. In bonding pad, the defect is coating.In active region, the defects are abnormal spots and scratches. In edge region, the defects are scratch and crack. These three parts are inspected sequentially for their defects. Good chip must pass all inspections of these three parts. Otherwise, chip is classified into bad chip without the inspection of next part when one part is rejected. Experimental result shows that the recognition rate of good chip can reach 99.21% and the recognition rate of bad chip can reach 90.48%.For inspection time, the average time of inspecting one chip by the system is about 6327.5 ms.