標題: Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints
作者: Chang, Y. W.
Chiu, S. H.
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Electromigration;flip-chip solder joints
公開日期: 1-十一月-2010
摘要: This study analyzes the effect of void propagation on the temperature increase of solder joints by using x-ray microscopy, Kelvin probes, and infrared microscopy. It was found that the temperature rise due to void formation was less than 1.3 degrees C when the voids depleted about 75% of the contact opening, even though bump resistance had increased to 10.40 times its initial value. However, the temperature rose abruptly with an increase of up to 8.0 degrees C when the voids depleted 96.2% of the contact opening. A hot spot was observed immediately before the occurrence of open failure in the solder bump. The local increase in temperature was about 30.2 degrees C at the spot. This spot may be the remaining contact area immediately before the occurrence of open failure.
URI: http://dx.doi.org/10.1007/s11664-010-1361-7
http://hdl.handle.net/11536/6012
ISSN: 0361-5235
DOI: 10.1007/s11664-010-1361-7
期刊: JOURNAL OF ELECTRONIC MATERIALS
Volume: 39
Issue: 11
起始頁: 2489
結束頁: 2494
顯示於類別:會議論文


文件中的檔案:

  1. 000283007300021.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。