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dc.contributor.authorHe, Bo-Chingen_US
dc.contributor.authorCheng, Chun-Huen_US
dc.contributor.authorWen, Hua-Chiangen_US
dc.contributor.authorLai, Yi-Shaoen_US
dc.contributor.authorYang, Ping-Fengen_US
dc.contributor.authorLin, Meng-Hungen_US
dc.contributor.authorWu, Wen-Faen_US
dc.contributor.authorChou, Chang-Pinen_US
dc.date.accessioned2014-12-08T15:07:39Z-
dc.date.available2014-12-08T15:07:39Z-
dc.date.issued2010-01-01en_US
dc.identifier.issn0026-2714en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.microrel.2009.08.005en_US
dc.identifier.urihttp://hdl.handle.net/11536/6018-
dc.description.abstractIn this paper, ultra-high vacuum chemical vapor deposition (UHV/CVD) was employed to synthesize silicon-germanium (SiGe), and sequence to endure annealing treatment. Morphological characterization, roughness, and microstructural morphology were observed by means of scanning electron microscopy (SEM), atomic force microscopy (AFM), and transmission electron microscopy (TEM). The elements distribution, crystallographic, and nanomechanical behavior were carried out using energy-dispersive Xray spectroscopy (EDS) mapping technique, X-ray diffraction (XRD), and nanoindentation technique. The annealing treated SiGe leads to the 2D germanium segregation on the surface. The phenomenon is interpreted in terms of dislocation-induced structural changes in annealing treatment, Thus, the dislocation propagation in the microstructure was observed. Subsequently hardness and elastic modulus were increased because of a comparatively unstable microstructure after annealing treatment. (C) 2009 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleEvaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrateen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.microrel.2009.08.005en_US
dc.identifier.journalMICROELECTRONICS RELIABILITYen_US
dc.citation.volume50en_US
dc.citation.issue1en_US
dc.citation.spage63en_US
dc.citation.epage69en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000274610400009-
dc.citation.woscount15-
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