Title: 銻化鋁及砷銻化鋁成長研究
Study to The Growth of AlSb and AlAsSb
Authors: 許靖豪
Xu, Jing-Hao
陳衛國
Chen, Wei-Guo
電子物理系所
Keywords: 砷銻化鋁;熱力學;固相組成;銻化鋁;電子物理;電子工程;AlAsSb;themodynamics;solid composition;AlSb;ELECTROPHYSICS;ELECTRONIC-ENGINEERING
Issue Date: 1995
Abstract: In this study,we have investigated using metalorganic chemical
vapor deposition(MOCVD) to grow AlSb and develop the dependence
of solid composition of AlAsSbon the factors of themodynamics,
growth rate,growth temperature and carrier flow rate.The
experiment results indicate that arsenic solid composition of
AlAsSb is proportional to molar flow rate of TBAs.This result is
agreement with the themodynamic prediction.Otherwise,arsenic
solid composition decreased as growthtemperature increased.We
think this result might be related to association of TBAs and
TMAl.Also,arsenic solid composition decreasedas growth rate and
carrier flow rate increased.Growth rate increasedas growth
temperature increased when growth temperature is below 625C and
the activation energy is 16.1kcal/mole.In the study of AlSb,we
first grow a buffer layer between substrate and epilayerin order
to improve film quality and investigated variation of growth
rate andfilm quality in different V-III ratio and growth
temperature.Samples were characterized by means of Ramanspectrum
measurement to understand the properties of this material.The
experimentresults indicate that when the temperature is below
700C,the growth is kinetically controlled and the activation
energy is 16.59kcal/mole.We find that catalysis might exist
between TMAl and TMSb.The results of Raman spectrum and X-
raydiffraction indicate that film quality is related to growth
temperature and V-III ratio.
URI: http://140.113.39.130/cdrfb3/record/nctu/#NT844429004
http://hdl.handle.net/11536/61235
Appears in Collections:Thesis