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dc.contributor.authorHuang, Ping-Weien_US
dc.contributor.authorWu, YewChung Sermonen_US
dc.date.accessioned2014-12-08T15:07:53Z-
dc.date.available2014-12-08T15:07:53Z-
dc.date.issued2010en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://hdl.handle.net/11536/6209-
dc.identifier.urihttp://dx.doi.org/10.1149/1.3339558en_US
dc.description.abstractAn AlGaInP-based vertical light emitting diode (LED) comprising double roughened (GaP and n-AlGaInP) surfaces and a bottom metal reflector was fabricated by surface-etching and wafer-bonding technologies. The roughened GaP surface was created by photolithography and wet etching, while the AlGaInP surface was roughened by inductively coupled plasma dry etching. The output power of the double roughened LED could reach 5.88 mW, which was 2.56 times higher than that of the conventional LED. This is because the double roughened surfaces can provide photons multiple chances to escape from the LED surface and can redirect photons.en_US
dc.language.isoen_USen_US
dc.subjectaluminium compoundsen_US
dc.subjectetchingen_US
dc.subjectgallium compoundsen_US
dc.subjectIII-V semiconductorsen_US
dc.subjectindium compoundsen_US
dc.subjectlight emitting diodesen_US
dc.subjectphotolithographyen_US
dc.subjectsurface roughnessen_US
dc.subjectwafer bondingen_US
dc.titleOutput Power of AlGaInP Light Emitting Diode Improved by Double Roughening AlGaInP Surfacesen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.3339558en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume13en_US
dc.citation.issue5en_US
dc.citation.spageH163en_US
dc.citation.epageH165en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000275660200022-
dc.citation.woscount2-
Appears in Collections:Articles