完整後設資料紀錄
DC 欄位語言
dc.contributor.author鄭至偉en_US
dc.contributor.authorChih Wei Chengen_US
dc.contributor.author李榮貴en_US
dc.contributor.authorDr. Rong-Kwei Lien_US
dc.date.accessioned2014-12-12T02:18:00Z-
dc.date.available2014-12-12T02:18:00Z-
dc.date.issued2003en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#GT009163508en_US
dc.identifier.urihttp://hdl.handle.net/11536/62290-
dc.description.abstract光罩成本已成為各大晶圓廠及無晶圓廠的設計公司主要的產品成本之一,大家紛紛尋找方法降低其成本.經由對黃光區曝光對準流程進行分析發現, 流程中測試曝光條件的步驟可利用迴歸分析模式預測曝光條件,改善曝光對準流程中需要先測試曝光條件的步驟,如此能夠改善因為測試曝光條件而增加的生產週期,提昇光罩產能有效的利用率. 驗證結果在不需增加任何機台購置成本的情況下,可提升17%的產能.zh_TW
dc.description.abstractThe cost for reticle-making is one of the most substantial factors in most IC foundries and design houses and every company takes lot efforts to increase its utilization. After studying the entire process flow of the photo operations, the test exposure condition can be omitted by applying the regression analysis. This will save the use of the reticle and increase the reticle capacity. The pilot run showed that the study is feasible and 17% extra capacity is gained.en_US
dc.language.isozh_TWen_US
dc.subject光罩產能zh_TW
dc.subject測試曝光條件zh_TW
dc.subject迴歸分析zh_TW
dc.subjectReticle capacityen_US
dc.subjectTesting exposure conditionen_US
dc.subjectRegression Analysisen_US
dc.title晶圓廠光罩產能分析與改善zh_TW
dc.titleReticle Capacity Analysis and Improvement for a Wafer Fabrication Factoryen_US
dc.typeThesisen_US
dc.contributor.department管理學院工業工程與管理學程zh_TW
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