| 標題: | 化學機械研磨在深次微米半導體元件製造之應用 = Application of chemical-mechanical polishing to the fabrication of deep submicron semiconductor devices |
| 作者: | 王英郎 馮明憲, 曾偉志 電子研究所 |
| 公開日期: | 1996 |
| URI: | http://140.113.39.130/cdrfb3/record/nctu/#NT856430119 http://hdl.handle.net/11536/62554 |
| Appears in Collections: | Thesis |
- A modified multi-chemicals spray cleaning process for post-CMP cleaning application / Wang, YL;Liu, C;Feng, MS;Tseng, WT
- 以電漿輔助化學氣相沈積低介電常數之含氟氧化物薄膜的化學機械研磨技術與材料特性研究 / 謝元智;Hsieh, Yuan-Tsu;馮明憲, 戴寶通;Feng Ming-Shiann, Dai Bau-Tong
- A modified multi-chemical spray cleaning process for post shallow trench isolation chemical mechanical polishing cleaning application / Wang, YL;Wang, TC;Wu, J;Tseng, WT;Lin, CF
- The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer / Chiu, SY;Wang, YL;Liu, CP;Lan, JK;Ay, C
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