具有限金屬厚度之埋藏式微帶線之分析與設計

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DC Field	Value	Language
dc.contributor.author	劉欣榮	en_US
dc.contributor.author	Liu, Hsin-Rong	en_US
dc.contributor.author	郭仁財	en_US
dc.contributor.author	Jen-Tsai Kuo	en_US
dc.date.accessioned	2014-12-12T02:18:59Z	-
dc.date.available	2014-12-12T02:18:59Z	-
dc.date.issued	1997	en_US
dc.identifier.uri	http://140.113.39.130/cdrfb3/record/nctu/#NT860435020	en_US
dc.identifier.uri	http://hdl.handle.net/11536/63040	-
dc.description.abstract	本文利用混合式全波空間頻域分析法,來分析埋藏式微帶線之傳播特性, 其中也包括了有限厚度對埋藏式微帶線之傳播特性之影響,本文亦包含了欲設計特性阻抗為50 及 75 歐姆之相關結構參數之關係,以供參考. A full-wave mixed spectral-domain approach (MSDA) is employed to analyzethe proagation characteristic of buried microstrip lines (BMSL's). The influence of finite metallization thickness on the dispersive propagationcharacteristic of BMSL is also included. Structural parameters for characteristicimpedances Zo=50 ohm, and 75 ohm are reported for reference of circuit design.	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	有限	zh_TW
dc.subject	厚度	zh_TW
dc.subject	埋藏	zh_TW
dc.subject	微帶線	zh_TW
dc.subject	finite	en_US
dc.subject	thickness	en_US
dc.subject	buried	en_US
dc.subject	microstrip	en_US
dc.title	具有限金屬厚度之埋藏式微帶線之分析與設計	zh_TW
dc.title	Analysis and Design of Buried Microstrip Lines with Finite Metallization Thickness	en_US
dc.type	Thesis	en_US
dc.contributor.department	電信工程研究所	zh_TW
Appears in Collections:	Thesis