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dc.contributor.authorLu, C. -Y.en_US
dc.contributor.authorChang, E. Y.en_US
dc.contributor.authorHuang, J. -C.en_US
dc.contributor.authorChang, C. -T.en_US
dc.contributor.authorLee, C. -T.en_US
dc.date.accessioned2014-12-08T15:08:04Z-
dc.date.available2014-12-08T15:08:04Z-
dc.date.issued2009-12-03en_US
dc.identifier.issn0013-5194en_US
dc.identifier.urihttp://dx.doi.org/10.1049/el.2009.1643en_US
dc.identifier.urihttp://hdl.handle.net/11536/6320-
dc.description.abstractAn AlGaN/GaN high electron mobility transistor (HEMT) with tungsten nitride (WNx) Schottky gate fabricated on a sapphire substrate is presented. Gate forward current stress was chosen to evaluate the stability of the Schottky gate. After stress, this WNx HEMT remains stable, while the conventional Ni/Au HEMT shows performance degradation and failure. The maximum output power density from this device is 5 W/mm at 2 GHz. A combination of these findings indicates the robust performance of this WNx material and its potential as a Schottky gate for AlGaN/GaN HEMTs.en_US
dc.language.isoen_USen_US
dc.titleStable AlGaN/GaN high electron mobility transistors with tungsten nitride gate metallisationen_US
dc.typeArticleen_US
dc.identifier.doi10.1049/el.2009.1643en_US
dc.identifier.journalELECTRONICS LETTERSen_US
dc.citation.volume45en_US
dc.citation.issue25en_US
dc.citation.spage1348en_US
dc.citation.epageU104en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000273043100049-
dc.citation.woscount3-
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