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dc.contributor.author徐千代en_US
dc.contributor.authorHsu, Chien-Daien_US
dc.contributor.author李榮貴en_US
dc.contributor.authorLee, Rong-Kweien_US
dc.date.accessioned2014-12-12T02:19:19Z-
dc.date.available2014-12-12T02:19:19Z-
dc.date.issued1997en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#NT863031029en_US
dc.identifier.urihttp://hdl.handle.net/11536/63330-
dc.description.abstract如何縮短生產週期和準時交貨,是目前IC封裝廠首要課題。本研究將針對IC封裝廠生產特性,從投料法則、訂單批量切割大小、和不確定因素管理等三方面來著手。首先,研究投料法則和訂單批量切割大小對生產週期的影響,以找出在那種組合下可以有較短的生產週期,提供規劃參考之用。再者,利用限制理論中整體安全保護時間的觀念,發展出一套能有效管理生產線的不確定因素,使訂單如期完成的進度控制模式,以取代目前IC封裝廠所使用的區段管理模式。最後,以四個生產績效指標:實際訂單平均生產週期、訂單平均趕工時間、訂單平均延遲時間、與訂單延遲百分比,比較整體安全保護時間模式和區段管理模式,孰較能有效的管理不確定因素,同時又可以獲得較短的生產週期,以達到“短交期與準時交貨”的目標。zh_TW
dc.description.abstractThe most important issue of the day in the IC packaging factory is to reduce the cycle time and to deliver the goods on time. According to the productive properties, this paper starts with rope rule, split lot size, and the management of uncertainty. The first, to research what relation there is between rope rule and cycle time, and between split lot size and cycle time. The second, to apply the concept of the aggregated buffer to manage the uncertainty in the productive lines, in order of delivery on time. And the last, to make a comparison between the model of section mangement and the model of aggregated buffer by the four production performance indexes, which are the average cycle time, the mean work overtime for order, the average delay time, and the percentile of delay order. To find out which one model could give consideration to both the shorter cycle time and delivery on time.en_US
dc.language.isozh_TWen_US
dc.subjectIC封裝廠zh_TW
dc.subject投料法則zh_TW
dc.subject訂單批量切割zh_TW
dc.subject區段管理zh_TW
dc.subject整體安全保護時間zh_TW
dc.subjectIC Packaging Factoryen_US
dc.subjectRope Ruleen_US
dc.subjectSplit Lot Sizeen_US
dc.subjectSection Managementen_US
dc.subjectAggregated Bufferen_US
dc.titleIC封裝廠短生產週期與訂單進度控制模式之研究zh_TW
dc.titleStudying the Short Cycle Time and the Model of the Due Date Control for IC Packaging Factoryen_US
dc.typeThesisen_US
dc.contributor.department工業工程與管理學系zh_TW
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