標題: Due-date performance improvement using TOC's aggregated time buffer method at a wafer fabrication factory
作者: Kuo, Tsai-Chi
Chang, Sheng-Hung
Huang, Shang-Nan
工業工程與管理學系
Department of Industrial Engineering and Management
關鍵字: Aggregated time buffer;Due-date control;On-time delivery;Wafer fabrication;Theory of constraints
公開日期: 1-三月-2009
摘要: Due-date performance is one of the most important production indexes for success utilized by wafer fabrication factories. Traditionally, the industry sets a Specific due-date tightness level and it dispatching rule based on the total processing time, the production capacity. pre-defined order release criteria and historical data, to ensure deliveries are made on-time. However, such policies typically do not solve the due-date performance problem at wafer fabrication factories, since the processes are highly complex. This investigation explores the due-date performance problem using the concept of the aggregated time buffer in critical chain project management (CCPM), which wits developed by Dr. Goldratt. A simulation model was constructed and the performance of the proposed method is evaluated based on four dispatching rules at a wafer fabrication factory. The findings reveal that applying aggregated time buffer control system improved the overall due-date control. in terms of on-time delivery rate, average tardiness, and variances in average tardiness and lateness, (C) 2008 Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.eswa.2007.12.038
http://hdl.handle.net/11536/7539
ISSN: 0957-4174
DOI: 10.1016/j.eswa.2007.12.038
期刊: EXPERT SYSTEMS WITH APPLICATIONS
Volume: 36
Issue: 2
起始頁: 1783
結束頁: 1792
顯示於類別:期刊論文


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