完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lin, S. H. | en_US |
dc.contributor.author | Chiang, K. C. | en_US |
dc.contributor.author | Yeh, F. S. | en_US |
dc.contributor.author | Chin, Albert | en_US |
dc.date.accessioned | 2014-12-08T15:08:08Z | - |
dc.date.available | 2014-12-08T15:08:08Z | - |
dc.date.issued | 2009-12-01 | en_US |
dc.identifier.issn | 0741-3106 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/LED.2009.2034113 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/6352 | - |
dc.description.abstract | We have studied the stress reliability of high-k Ni/TiO(2)/ZrO(2)/TiN metal-insulator-metal capacitors under constant-voltage stress. The increasing TiO(2) thickness on ZrO(2) improves the 125-degrees C leakage current, capacitance variation (Delta C/C), and long-term reliability. For a high density of 26 fF/mu m(2), good extrapolated ten-year reliability of small Delta C/C similar to 0.71% is obtained for the Ni/10-nm-TiO(2)/6-5-nm-ZrO(2)/TiN device at 2.5-V operation. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Improved Stress Reliability of Analog Metal-Insulator-Metal Capacitors Using TiO(2)/ZrO(2) Dielectrics | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/LED.2009.2034113 | en_US |
dc.identifier.journal | IEEE ELECTRON DEVICE LETTERS | en_US |
dc.citation.volume | 30 | en_US |
dc.citation.issue | 12 | en_US |
dc.citation.spage | 1287 | en_US |
dc.citation.epage | 1289 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
顯示於類別: | 期刊論文 |