具有有限線金屬厚度之單一與耦合埋藏式微帶線的特性分析

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	宋家駒	en_US
dc.contributor.author	Jia-Jiu Song	en_US
dc.contributor.author	郭仁財	en_US
dc.contributor.author	Jen-Tsai Kuo	en_US
dc.date.accessioned	2014-12-12T02:21:05Z	-
dc.date.available	2014-12-12T02:21:05Z	-
dc.date.issued	1998	en_US
dc.identifier.uri	http://140.113.39.130/cdrfb3/record/nctu/#NT870435105	en_US
dc.identifier.uri	http://hdl.handle.net/11536/64565	-
dc.description.abstract	本文使用全波混合空間頻域分析法，來研究具有有限線金屬厚度之單一與耦合埋藏式微帶線的傳輸與衰減特性，其中描述了結構參數對傳輸線參數的影響，將會發現埋藏式微帶線特有的高隔離特性，使得它非常適合應用在高密度積體電路中的高速信號傳輸上。	zh_TW
dc.description.abstract	A full-wave mixed spectral-domain approach (MSDA) is employed to investigate the propagation and attenuation characteristics of single and coupled buried microstrip lines (BMSL's) with finite strip metallization thickness. The influences of structural parameters on line parameters are presented. It is shown that BMSL's have high-isolation characteristics and are suitable for high-speed signal transmission in high-density integrated circuits.	en_US
dc.language.iso	en_US	en_US
dc.subject	混合空間頻域分析法	zh_TW
dc.subject	埋藏式微帶線	zh_TW
dc.subject	傳輸線參數	zh_TW
dc.subject	高密度積體電路	zh_TW
dc.subject	mixed spectral-domain approach	en_US
dc.subject	buried microstrip lines	en_US
dc.subject	line parameters	en_US
dc.subject	high-density integrated circuits	en_US
dc.title	具有有限線金屬厚度之單一與耦合埋藏式微帶線的特性分析	zh_TW
dc.title	Characterization of Single and Coupled Buried Microstrip Lines with Finite Strip Metallization Thickness	en_US
dc.type	Thesis	en_US
dc.contributor.department	電信工程研究所	zh_TW
顯示於類別：	畢業論文