含矽石聚亞醯胺的製備及其特性之研究

Abstract

由BTDA(3,3’,4,4’-benzophenone tetracarboxylic dianhydride)與選用四種不同結構的二胺，以及APTS(p-Aminophenyltrimethoxysilane)反應，合成出一系列各種不同網目分子鏈長的PISi (polyimide-silica)，隨著APTS含量的增加，其storage modulus以及Tg跟著上升，然而□-relaxation damping peak強度卻減小，前者的原因可能是由於交聯密度的增加，以及網狀結構的堅硬性所致，後者的原因可能是網目中的分子鏈與分子鏈之間被撐開，使得鏈與鏈之間的相互作用力變小，導致damping強度減弱。另外在動態機械分析(DMA)的研究中，在變溫下利用多頻掃描進行系統性的研究，經推移得主曲線(master curve)，由此曲線可得到一結論為，PISi在高溫及長時間條件下比pure PI有更高的可靠性(reliability)，而且經改質過的後的PISi薄膜，其結構是成三度空間網狀構造，比起未改質的聚亞醯胺薄膜，它具有更高的熱穩定性以及較低的流膠量與熱膨脹係數，使其應用於電子構裝時有較佳的穩定性。

A series of polyimide-silica hybrid films were prepared with various of aromatic diamine monomers, APTS(p-Aminophenyltrimethoxysilane) and BTDA(3,3’,4,4’-benzophenone tetracarboxylic dianhydride). In the series of PISi films, decreasing the PI block chain length enhances the storage modulus and Tg, but shortens the □-relaxation damping peak intensity. The former two may be due to increasing the crosslinking density and the rigidity of the network structure. The next is due to the PI interblock separation and decreasing the interblock PI chain interaction. Dynamic mechanical analysis (DMA) measures the modulus properties of PISi films by using multifrequency and accelerated temperature measurement. It is found that the PISi films have better reliability than pure PI at higher temperature and longer times. The polyimide-silica hybrid films are three dimensional structure. The silica-modified polyimide have higher thermal stability than generally type polyimide. Besides, they have lower melt flow and coefficients of thermal expansion. That will obtain a good reliability for electronic package application.