含矽氧烷雙馬來亞醯胺與環氧樹脂之合成與性質研究

Abstract

本研究合成含矽氧烷、C10及C4雙馬來亞醯胺。上述雙馬來亞醯胺與MXDA(1)以1:1莫耳比例在50度反應2小時生成的寡聚物，作為環氧樹脂的硬化劑。(2)以2:1和3:1莫耳比例50度反應1小時生成的寡聚物，加熱行自交聯。本研究也合成含矽氧烷環氧樹脂，此含矽氧烷環氧樹脂與商業產品DGEBA分別與上述三種寡聚物反應，得六種雙馬來亞醯胺交聯環氧樹脂。寡聚物硬化DGEBA在玻璃轉移溫度、耐熱性、介電和機械強度上優於寡聚物硬化含矽氧烷環氧樹脂。寡聚物行自交聯產物的玻璃轉移溫度和耐熱性質優於寡聚物與環氧樹脂交聯後產物。柔軟長鏈可以增加黏著強度和降低介電常數，但是相對的也降低了機械強度、玻璃轉移溫度和提高了熱膨脹係數。導入矽氧烷結構在熱穩定性質上有較好表現。交聯產物在黏著、介電、耐熱性質上與目前既有的封裝材料性質相近甚至更好，適於做電子元件的封裝。

The present concerns includes the synthesis of three Bismale-imides, ie, 1,3-Bismaleimidobispropyl-1,1,3,3,-tetramethyldi-siloxane, 1,10-Bismale- imidodecane and 1,4-Bismaleimidobutane. These three Bismaleimides reacted with MXDA (a) in molar ratio of 1:1 at 50℃ for two hours to form Oligomers, which were then used as curing agents for epoxy; (b) in molar ratios of 2:1 and 3:1, respectively, at 50℃ for an hour to from Oligomers which were further cured upon heating. This study also covered the preparation of siloxane-containing epoxy（diglycidyl ether of disiloxane, DGEDS）. The DGEDS and commercial DGEBA were reacted with the above formed three Oligomers to form six cured products. The DGEBA products were superior to DGEDS cured products in glass temperatures, thermal stability, dielectric constant & mechanical strength. Incorporating flexible long chain in the bismaleimide significantly increases the adhesion and the decrease dielectric constant of the final products, but at the same time, decreases the mechanical strength and glass temperature. In the meantime, siloxane inserted to the molecular structure also increases thermal stability. These materials are permissible candidates for electronic packaging applications.