半導體產業一元化代工服務(Turn Key Service)之研究

Abstract

台灣近年來在半導體高科技領域逐漸地嶄露頭角，健全代工體系將成為未來台灣競爭之基石。但隨著產業生態變化及越來越激烈的全球化競爭，以及下游產品的短生命週期與快速需求變化之環境下，半導體業者必須要掌握市場趨勢並快速有效的回應以改善過去產業、產品及市場過度集中的情況，故此建立能整合上、中、下游的供應鏈管理（Supply Chain Management）體系，為IC產業發展過程的必經之路。而目前在半導體產業界發展出一種新的生產模式，就是當IC設計公司向晶圓製造廠下單時，晶圓製造廠可以提供從晶圓代工、封裝、測試的全套服務，此種服務又稱為Turn Key Service，並且許多公司也越來越重視這個服務模式。但是我們可以發現到，目前台灣的半導體產業中採用Turn Key Service模式佔晶圓代工廠實際接單的百分比並不高。問題原因是什麼呢？ 本論文即是利用訪談、問卷調查及限制理論等研究工具。將研究從需求分析開始，透過訪談與問卷調查的方式確認晶圓代工廠與IC設計公司的問題所在，再根據研究結果，探究到底目前雙方問題的落差哪裡有何衝突？晶圓代工廠應該要改變或增加什麼樣的服務或方式才能真正符合他們客戶（IC設計公司）的需要呢？並找出處於現行的Turn Key Service模式中有哪些因素在執行Turn Key Service模式上最適合且順暢的。

Recently, Taiwan has stood out conspicuously in the high technological field of semiconductor industry. The integrity as a system of O.E.M. will be the cornerstone of competition in the world. According to the knee competition of globalization and the high-speed transition of industrial environment, the semiconduct or industry not only has to master the trend of the market, but also has to make the response fast and effectively. Therefore it is a necessary step of deploying IC industry by establishing a supply chain system, which can integrate the upstream, midstream, and downstream suppliers. Nowadays’ a business model, called Turn Key Service, is introduced and implemented. This is the way that foundry fabs will offer the entire service including wafer, fabrication, probing, packaging, and final testing, once the IC Design Houses make orders to them. However, a very small portion of foundry business applying the Turn Key Service which will be one of the key success ful factors of this industry in the future. The purpose of this study is to identify the unsolved problems existing between the foundry fabs and IC Design Houses in Taiwan by using interview, questionnaire and the theory of constraint. We also identify the important factors in implementing the Turn Key Service model. So that, foundrys fabs can make an improvement on their service to conform the demand ordered by their customers.