標題: | Assembly of Micro-3-D Components on SOI Wafers Using Novel SU-8 Locking Mechanisms and Vertical One-Push Operation |
作者: | Chiu, Yi Wu, Chang-Shiou Huang, Wei-Zhi Wu, Jhong-Wei 電控工程研究所 Institute of Electrical and Control Engineering |
關鍵字: | Assembly;hinge;microelectromechanical system (MEMS);one push;out of plane |
公開日期: | 1-九月-2009 |
摘要: | A novel out-of-plane assembly technique of 3-D microstructures is proposed and demonstrated by using simple vertical one-push operations. This one-push method has large probe positioning tolerance in both vertical and lateral directions to reduce the overall complexity of the assembly process. Micromirrors and corner cube reflectors are fabricated on silicon-on-insulator wafers using SU-8 photoresist as a second structure layer in a low-temperature process. Batch assembly of multiple mirrors assembled simultaneously is demonstrated. |
URI: | http://dx.doi.org/10.1109/JSTQE.2009.2018478 http://hdl.handle.net/11536/6776 |
ISSN: | 1077-260X |
DOI: | 10.1109/JSTQE.2009.2018478 |
期刊: | IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS |
Volume: | 15 |
Issue: | 5 |
起始頁: | 1338 |
結束頁: | 1343 |
顯示於類別: | 期刊論文 |