標題: Assembly of Micro-3-D Components on SOI Wafers Using Novel SU-8 Locking Mechanisms and Vertical One-Push Operation
作者: Chiu, Yi
Wu, Chang-Shiou
Huang, Wei-Zhi
Wu, Jhong-Wei
電控工程研究所
Institute of Electrical and Control Engineering
關鍵字: Assembly;hinge;microelectromechanical system (MEMS);one push;out of plane
公開日期: 1-九月-2009
摘要: A novel out-of-plane assembly technique of 3-D microstructures is proposed and demonstrated by using simple vertical one-push operations. This one-push method has large probe positioning tolerance in both vertical and lateral directions to reduce the overall complexity of the assembly process. Micromirrors and corner cube reflectors are fabricated on silicon-on-insulator wafers using SU-8 photoresist as a second structure layer in a low-temperature process. Batch assembly of multiple mirrors assembled simultaneously is demonstrated.
URI: http://dx.doi.org/10.1109/JSTQE.2009.2018478
http://hdl.handle.net/11536/6776
ISSN: 1077-260X
DOI: 10.1109/JSTQE.2009.2018478
期刊: IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
Volume: 15
Issue: 5
起始頁: 1338
結束頁: 1343
顯示於類別:期刊論文


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