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dc.contributor.authorChang, M. F.en_US
dc.contributor.authorLee, P. T.en_US
dc.contributor.authorChin, Alberten_US
dc.date.accessioned2014-12-08T15:09:02Z-
dc.date.available2014-12-08T15:09:02Z-
dc.date.issued2009-08-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2009.2023824en_US
dc.identifier.urihttp://hdl.handle.net/11536/6873-
dc.description.abstractBy using HfAlO as a capping layer on SiON, MoN/HfAlO/SiON p-MOSFETs show an effective work function of 5.1 eV, a low threshold voltage of -0.1 V, and a peak hole mobility of 80 cm(2)/(V . s) at small equivalent oxide thickness of 0.85 nm. These self-aligned and gate-first p-MOSFETs processes, with standard ion implantation and 1000 degrees C rapid thermal annealing, are fully compatible with current very large scale integration fabrication lines.en_US
dc.language.isoen_USen_US
dc.subjectCapping layeren_US
dc.subjectHfAlOen_US
dc.subjectMoNen_US
dc.subjectp-MOSFETsen_US
dc.titleLow-Threshold-Voltage MoN/HfAlO/SiON p-MOSFETs With 0.85-nm EOTen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2009.2023824en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume30en_US
dc.citation.issue8en_US
dc.citation.spage861en_US
dc.citation.epage863en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000268342400024-
dc.citation.woscount7-
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