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dc.contributor.authorWeng, Wu-Teen_US
dc.contributor.authorLee, Yao-Jenen_US
dc.contributor.authorLin, Hong-Chihen_US
dc.contributor.authorHuang, Tiao-Yuanen_US
dc.date.accessioned2014-12-08T15:09:04Z-
dc.date.available2014-12-08T15:09:04Z-
dc.date.issued2009-08-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.48.086001en_US
dc.identifier.urihttp://hdl.handle.net/11536/6909-
dc.description.abstractThe effects of damage on mixed-signal (MS)/radio-frequency (RF) circuits integrated with metal-insulator-metal (MIM) capacitors and advanced metal-oxide-semiconductor field-effect transistors (MOSFETs) are studied in this work. The impact of damage on an MIM oxide is evaluated by connecting its capacitor top metal (CTM) to an upper-level metal with a large antenna ratio (AR(CTM)) used in an actual CTM circuit connected to an interconnect. In addition to the dielectric degradation of a transistor, we also investigate the damage-enhanced negative bias temperature instability (NBTI) degradation of a transistor with its gate electrode connected to an MIM capacitor with a large ARCTM for various gate oxide thicknesses. A model is proposed to explain the experimentally observed dependence of NBTI degradation on AR(CTM) and accurately simulate failure distributions in the presence of plasma damage. (C) 2009 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleEffects of Plasma Damage on Metal-insulator-Metal Capacitors and Transistors for Advanced Mixed-Signal/Radio-Frequency Metal-Oxide-Semiconductor Field-Effect Transistor Technologyen_US
dc.typeArticleen_US
dc.identifier.doi10.1143/JJAP.48.086001en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume48en_US
dc.citation.issue8en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000269497300070-
dc.citation.woscount0-
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