雷射銲接於光通訊元件封裝之有限元素分析

Abstract

在今天資訊爆炸的時代，光纖通訊正是解決頻寬需求的最佳方案。針對光連接器封裝TO-type Package而言，雷射銲接製程已廣泛地應用於產業界，但對於銲接後，材料由高溫冷卻到室溫，所產生的材料性質變化、殘留應力與銲後位移，仍缺乏一個有效的預測。本論文的目的，是希望透過有限元素模擬分析，可以有效率地預測光通訊元件上的銲接行為，達到製程改善的目的。 經過一連串的模擬嘗試與實驗驗證，我們證明了熱應力分析應用在雷射銲接光通訊元件的可行性。最後利用三維有限元素分析，我們可以初步地模擬出三點式雷射銲接的情況，並探討在不同銲池深度與定位角度的條件下，所造成的銲後位移情形。

In this age of heavy traffic networks, fiber optical communication is the best way to meet the demand for bandwidth. Laser welding of TO-type package is popular in the fiber optical communication industry. However, the changes of the properties of the welded material on cooling from high temperature, the residual stress and the post-weld-shift still cannot be accurately predicted. Consequently, this research aims to analyze the welding behavior in TO-type packages using the finite element method, to improve efficiently laser welding. Through a series of simulations and experiments, the coupled thermal-stress analysis is shown to be applicable to the laser welding of the TO-type package. 3-D finite element simulation can successfully be applied to three-point laser welding. The effects of different weld depths and weld locations on the post-weld-shift of the TO-type package are discussed.