田口方法於球閘陣列載板製程改善之應用

Abstract

在半導體生產的製程中，球閘陣列載板（Ball Grid Array Substrates，簡稱BGA基板）已廣泛應用於積體電路的封裝製程上。由於BGA基板的製程流程時間長，產品的信賴度測試通常在完成成品後進行，若成品信賴度測試不合格將造成該生產批完全報廢無法出貨，如此不僅造成製造商成本損失，同時嚴重影響對客戶的交貨延遲，對供應商的信譽與客戶的流失造成影響。 許多研究在探討封裝製程上的參數最佳化設計時，把BGA基板列為原料的一環，而忽略了BGA基板本身複雜的變異特性。 本研究經由實際操作BGA基板製程的工程與技術人員透過要因分析法，分析防焊綠漆（Solder Mask）和電鍍鎳金（Ni/Au Plating）二個影響錫球接著強度的關鍵製程，找出影響的主要因子。接著利用田口所發展的參數設計方法，以錫球接著強度為品質特性，選擇以三水準為主體的實驗配置架構，配合內、外側直交表的配置，利用望大特性和信號雜音比進行資料分析。研究結果顯示，此分析方法可成功獲得較佳的生產條件，利用此條件可以幫助BGA基板製程技術的穩定設計，獲致最佳的錫球接著強度，以提升BGA基板出貨後的品質信賴度。

In IC packaging of Semi-Conductor industry, BGA substrate has been applied as a packaging material in considerable quantities. The BGA product has a long process cycle time, and the finished goods need to pass the reliability test before shipment. It will impact manufacturer on cost and delivery performance if the reliability test got a negative result and scrapped whole lot of BGA substrates. Many researches in study of the optimal parameter of package process take the BGA substrate as one of packaging materials, but ignore BGA itself of complicated variations. In this research, through Factor Analysis methodology by experienced BGA substrates Technicians, we analyze the process of Solder Mask and Ni/Au plating which are two of key processes of affecting Solder Joint strength. Then we employ the Taguchi’s Parameter Design method to improve solder join capability, decided as reading value by “Ball Shear Test”. The study was also analyzed along with appropriate orthogonal arrays to accelerate and simplify the process of experiment. Implementation results demonstrate that the Taguchi’s approach could get an optimal production condition to improve solder joint strength.