完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChang, I-Chunen_US
dc.contributor.authorHuang, Ting-Kaien_US
dc.contributor.authorLin, Huang-Kaien_US
dc.contributor.authorTzeng, Yu-Fengen_US
dc.contributor.authorPeng, Chih-Weien_US
dc.contributor.authorPan, Fu-Mingen_US
dc.contributor.authorLee, Chi-Youngen_US
dc.contributor.authorChiu, Hsin-Tienen_US
dc.date.accessioned2014-12-08T15:09:15Z-
dc.date.available2014-12-08T15:09:15Z-
dc.date.issued2009-07-01en_US
dc.identifier.issn1944-8244en_US
dc.identifier.urihttp://dx.doi.org/10.1021/am900264uen_US
dc.identifier.urihttp://hdl.handle.net/11536/7067-
dc.description.abstractGrowth of arrays of pagoda-topped tetragonal Cu nanopillar (length 1 - 6 mu m; width 150 +/- 25 nm) with {100) side races on Au/glass is achieved by,a simple electrochemical reduction of CuCl(2)(aq) by Al(s) in aqueous dodecyltrimethylammonium chloride. Field-emission measurement shows that the Cu nanopillars can emit electrons (10 mu A cm(-2)) at a turn-on field or 12.4 V mu m(-1) with a calculated held enhancement factor of 713.en_US
dc.language.isoen_USen_US
dc.subjectelectrochemical reductionen_US
dc.subjectpagodaen_US
dc.subjectcopperen_US
dc.subjectnanopillaren_US
dc.subjectfield emissionen_US
dc.titleGrowth of Pagoda-Topped Tetragonal Copper Nanopillar Arraysen_US
dc.typeArticleen_US
dc.identifier.doi10.1021/am900264uen_US
dc.identifier.journalACS APPLIED MATERIALS & INTERFACESen_US
dc.citation.volume1en_US
dc.citation.issue7en_US
dc.citation.spage1375en_US
dc.citation.epage1378en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.identifier.wosnumberWOS:000268310800004-
dc.citation.woscount5-
顯示於類別:期刊論文


文件中的檔案:

  1. 000268310800004.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。