完整後設資料紀錄
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dc.contributor.author張文耀en_US
dc.contributor.authorWen-Yao Changen_US
dc.contributor.author李安謙en_US
dc.contributor.authorAn-Chen Leeen_US
dc.date.accessioned2014-12-12T02:31:22Z-
dc.date.available2014-12-12T02:31:22Z-
dc.date.issued2002en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#NT910489097en_US
dc.identifier.urihttp://hdl.handle.net/11536/70857-
dc.description.abstract本文以實體迴路之方法建構一個傳輸模組及快速熱處理系統模擬器來驗證傳輸模組控制器,以及快速熱處理設備控制器。文中探討模擬器的設計與實做之議題,使得模擬器擁有擴充性,及模組化之架構。 著眼於MATLAB 對於模型建構以及即時模擬提供了完善的工具,故本文以MATLAB 來作為模擬器之開發工具。模擬器中關於快速熱處理系統之晶圓升溫模型則以類神經網路方法來建立,並將該模型整合至模擬器中來驗證實驗室所建構中的快速熱處理系統控制器。zh_TW
dc.description.abstractIn this thesis, we will develop transfer module (TM) and rapid thermal processing (RTP) simulators in order to verify the performance of transfer module controller (TMC) and RTP controller by using the concept of Hardware-in-the-loop (HIL). The design and implementation issues will be discussed to make the simulator more extendable and modularized. MATLAB , which has powerful tool boxes for real-time simulation and model construction, is adopted as a developing tool for the simulator. In addition, neural network approach is used to model the wafer heating processing. Then it is integrated into the simulator to verify the RTP controller. The testing procedures as well as testing results are presented in the thesis.en_US
dc.language.isozh_TWen_US
dc.subject實體迴路zh_TW
dc.subject傳輸模組zh_TW
dc.subject快速熱處理zh_TW
dc.subject類神經網路zh_TW
dc.subjectHardware-in-the-loopen_US
dc.subjectTrnasfer Moduleen_US
dc.subjectRapid Thermal Processingen_US
dc.subjectneural networken_US
dc.title傳輸模組與快速熱處理模組實體迴路模擬器之設計與實做zh_TW
dc.titleHardware-in-the-loop TM and RTP Simulator Design and Implementationen_US
dc.typeThesisen_US
dc.contributor.department機械工程學系zh_TW
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