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dc.contributor.author林聖珣en_US
dc.contributor.authorShan-Hsun Linen_US
dc.contributor.author鄭璧瑩en_US
dc.contributor.authorDr. Pi-Ying Chengen_US
dc.date.accessioned2014-12-12T02:32:06Z-
dc.date.available2014-12-12T02:32:06Z-
dc.date.issued2004en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#GT009214526en_US
dc.identifier.urihttp://hdl.handle.net/11536/71236-
dc.description.abstract本論文的研究重點在於利用ANSYS可以模擬動態熱源熱加工過程的熱應力分析與模擬。本研究使用ANSYS在模擬熱源移動的分析計算,就是逐步循序重新定義施加熱源功率及作用時間及承續前階段狀態,再進行疊加解析的暫態特性分析過程。大多數ANSYS使用者都偏好使用ANSYS的圖形化使用介面(GUI, Graphical User Interface)執行所有動作,但是利用GUI在進行重複性的動作時,容易有資料輸入的錯誤或漏失的缺點且不易執行動態的連續性分析過程。本研究擬用ANSYS的參數程式語言(APDL)與ANSYS分析模擬互相搭配,順利發展出為特定熱加工形式的模擬程式與工具。本論文研究藉由APDL運作在時間與負載的疊代,輔助進行熱加工的暫態分析,進而逐步取得所求熱應力的結果。此外,由於考慮到平板熱加工時的雷射切割光源,或是焊接熱源,並不是均勻光源。因此,為了解非均勻光源對熱加工應力應變的影響是本研究另一特色。利用APDL函數參數的設定,模擬定義各種函數形式的切割熱源效率,搭配網格微細化定義,藉以探討熱加工時,熱應力與熱應變的變化趨勢與效果,提供雷射或熱源加工的加工程序與參數最佳化設計的評估與分析。zh_TW
dc.description.abstractThe study focus on the analysis of the thermal stress distribution for the case of moving heat source working on a panel in transient state. This study uses ANSYS to calculate the analysis of the heat source moving. Alternately transient analysis process is redefined heat force and time at every load step, and added the state of last load step. Most ANSYS users like using the ANSYS GUI (Graphical User Interface) to execute all steps, but it is apt to make mistake during input data and difficult to carry out transient continuity to analysis the course. So APDL (ANSYS Parametric Design Language) of ANSYS is used with the analysis of ANSYS in this study to develop a program of specific thermal working simulating process. This study is taking the analysis result by redefining load and time with APDL and transient restart. In addition, heat source working on a panel is not uniform. So it is a feature to analysis that a no-uniform heat source effect on thermal stress and strain. By the way of simulate heat source function by APDL and redefine the mesh size, we can get a tendency of thermal stress and strain during thermal working. It can offer some proposition during laser or heat source working that parameter optimization and designed the heat source.en_US
dc.language.isozh_TWen_US
dc.subject熱應力zh_TW
dc.subject動態熱源zh_TW
dc.subject暫態特性分析zh_TW
dc.subjectANSYS參數程式語言zh_TW
dc.subjectThermal Stressen_US
dc.subjectMoving Heat Sourceen_US
dc.subjectTransient State Analysisen_US
dc.subjectAPDLen_US
dc.title移動式熱源在平板加工的耦合熱應力分析與模擬zh_TW
dc.titleThe Coupling Thermal Stress Analysis and Simulation for the Moving Heat Source Working on a Panelen_US
dc.typeThesisen_US
dc.contributor.department機械工程學系zh_TW
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