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dc.contributor.authorJian, S. -R.en_US
dc.contributor.authorLi, J. -B.en_US
dc.contributor.authorChen, K. -W.en_US
dc.contributor.authorJang, Jason S. -C.en_US
dc.contributor.authorJuang, J. -Y.en_US
dc.contributor.authorWei, P-Jen_US
dc.contributor.authorLin, J-F.en_US
dc.date.accessioned2014-12-08T15:09:20Z-
dc.date.available2014-12-08T15:09:20Z-
dc.date.issued2010-10-01en_US
dc.identifier.issn0966-9795en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.intermet.2010.03.034en_US
dc.identifier.urihttp://hdl.handle.net/11536/7123-
dc.description.abstractIn this study, the mechanical responses of the bonded interface method derived Mg(58)Cu(28.5)Gd(11)Ag(2.5) bulk metallic glasses (BMG) under the micro-/nano-indentation are investigated. A modified expanding cavity model is developed to analyze the morphological observations of shear band by Vickers indentation. Results indicate that the radius ratio of any two adjacent shear band circles is approximately constant. The ratio of the shear band deformation zone to the contact radius induced by indentation is also a constant, which depends on the constraint factor (the ratio of hardness to yield strength) of the material. The features predicted by the present model are consistent with the results obtained from the indentation experiments, indicating the validity of the expanding cavity model for describing the mechanical behaviors of the BMG materials. The cross-sectional transmission electron microscopy (XTEM) observations reveal that the terraced shear bands are formed on the interface of the bonded Mg-based BMG. The microstructures for the Vickers indentation-induced terraced shear bands are also discussed. (C) 2010 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectGlassesen_US
dc.subjectmetallicen_US
dc.subjectMechanical propertiesen_US
dc.subjecttheoryen_US
dc.subjectMechanical testingen_US
dc.subjectElectron microscopyen_US
dc.subjecttransmissionen_US
dc.titleMechanical responses of Mg-based bulk metallic glassesen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.intermet.2010.03.034en_US
dc.identifier.journalINTERMETALLICSen_US
dc.citation.volume18en_US
dc.citation.issue10en_US
dc.citation.spage1930en_US
dc.citation.epage1935en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000281420700033-
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