半導體機台設備維護保養時之局部排氣改善研究

Abstract

摘要 我國近年來高科技產業蓬勃發展，在政府之政策推動下，預估至公元2010年，臺灣將取代韓國，而成為全世界第三大半導體產值之國，僅次於美國與日本。目前國內半導體製造設備故障維修雖有維修手冊，但相關的經驗仍屬於工程師或專家的個人經驗知識，使得許多經驗與知識無法傳承下來，另一方面，半導體製造設備種類多、精密度高等因素亦增加了故障維修上的複雜度。 故所謂的"半導體機台設備維護保養時之局部排氣改善設備"簡稱"PM Hood"就是一種排氣風罩應用於機台設備預防保養(PM，Preventive Maintenance) ，其主要目的在於保護員工之健康，避免吸入有危害性的氣體或是粉塵。 研究目的: 本研究係利用局部排氣設備改善機台PM（Preventive Maintenance）時產生的化學氣體散溢，以達到下列目標： A、保護作業人員吸入有害之化學氣體 B、降低散溢之化學氣體對設備及產品的危害 C、減少異味問題 而局部排氣設備包含特殊氣罩及管路，則需達到下列功能： A、有效性：氣罩以低風量且高效能的方向設計，期望在現有狀況可提供的風量與靜壓下達到其最佳捕捉效果；管路則是採低壓損設計方式以降低管路所造成的壓損。 B、方便性：氣罩不可妨礙作業人員作業且方便拆裝，以提高氣罩的實用性。 研究方法 利用FTIR偵測器來分析驗證"PM Hood"的功效。利用FTIR偵測器來分析危害性氣體溢散到機台外的濃度，我們量測"PM Hood"內部及外部的濃度來驗證"PM Hood"可以明顯降低"PM Hood"外部的濃度，證實"PM Hood"可以有效的帶走內部的殘留有危害性的氣體。圖為局部排氣系統示意圖，藉由FTIR的兩個取樣點，我們可以很容易地藉由這"PM Hood"內部及外部兩個的濃度來計算出"PM Hood"的捕捉效率。 局部排氣系統示意圖 工作範圍說明： 茲以某半導體公司為例，共計進行有6次局部排氣改善試驗，詳如下表說明： PM Hood Project Quantity Summary Area Tool Type Etch Area Applied Material Centura DPS metal etcher Etch Area Applied Material Centura HDPdielectricetcher Etch Area Lam research 9600 Etch Area Mattson technology Aspen strip Etch Area Novellus W-Plug Etch Area TEL DRM Total quantity: 6 sets 本計劃(機台設備局部排氣改善計畫)共完成6型機台PM Hood的設計與6型機台PM時污染物的量測。發現機台維護保養時產生之大量氣狀污染物（Cl2、BCl3、CHF3、CO、IPA….etc）及粒狀污染物（金屬燻煙、粉塵微粒）不僅可能破壞無塵室之潔淨度，更對於工作人員的健康造成嚴重的影響。同時，經由FTIR污染物量測的驗證，所有的PM Hood設計均可將污染物侷限於Chamber內部而不逸散至環境，有效降低污染的程度與範圍，其污染物補集效率均大於90%。

ABSTRACT The semiconductor industry in Taiwan developed rapidly under the government policy. Taiwan may replace Korea to become the largest semiconductor-manufacturing country beyond United States and Japan in 2010. There are operation and maintenance handbooks for semiconductor-manufacturing equipments, however, due to the large variety of equipments and high accuratcy requirements for the equipements, the complexity for the equipments maintenance and troubleshooting increase. The local exhaust hood improvement for the semiconductor manufacturing equipments can be used as preventive maintenance tool. In this study, we call it “PM Hood”. The PM Hood was designed to prevent employees from breathing toxic gas or suspended solid and thus protect their health during maintenance. We designed six types of PM hoods for six different types of semiconductor manufacturing equipments in this project. It was found that a lot of aeration pollutants (including Cl2、BCl3、CHF3、CO、IPA…etc) and solid pollutants (including metal vapors and suspended solid) can be avoided during preventive maintenance. These pollutants may affect the clean room cleanliness and make serious impact on employees’ healthy if not reduced. All the PM hoods could control pollutants inside the chamber and prevent them form emiting into the atmosphere. The collection efficiency was above 90% in all types of PM hood designed. We have successfully designed the PM hood for PM operation. However, the design of the PM hood depends on the machine type, however, the internal chamber parts may cause some PM hood operation inconvenient. Therefore, how to communicate with machine manufacturing vendors to add the PM hood idea into new type of machines will be the most important thing in the future.