完整後設資料紀錄
DC 欄位語言
dc.contributor.authorYen, Cheng-Chengen_US
dc.contributor.authorKer, Ming-Douen_US
dc.date.accessioned2014-12-08T15:09:25Z-
dc.date.available2014-12-08T15:09:25Z-
dc.date.issued2009-06-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2009.2017625en_US
dc.identifier.urihttp://hdl.handle.net/11536/7199-
dc.description.abstractFour power-rail electrostatic-discharge (ESD) clamp circuits with different ESD-transient detection circuits have been fabricated in a 0.18-mu m CMOS process to investigate their susceptibility against electrical fast-transient (EFT) tests. Under EFT tests, where the integrated circuits in a microelectronic system have been powered up, the feedback loop used in the power-rail ESD clamp circuits may lock the ESD-clamping NMOS in a "latch-on" state. Such a latch-on ESD-clamping NMOS will conduct a huge current between the power lines to perform a latchuplike failure after EFT tests. A modified power-rail ESD clamp circuit has been proposed to solve this latchuplike failure and to provide a high-enough chip-level ESD robustness.en_US
dc.language.isoen_USen_US
dc.subjectElectrical fast-transient (EFT) testen_US
dc.subjectelectromagnetic compatibilityen_US
dc.subjectelectrostatic discharge (ESD)en_US
dc.subjectESD protection circuiten_US
dc.subjectlatchupen_US
dc.subjectsystem-level ESD stressen_US
dc.titleThe Effect of IEC-Like Fast Transients on RC-Triggered ESD Power Clampsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2009.2017625en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume56en_US
dc.citation.issue6en_US
dc.citation.spage1204en_US
dc.citation.epage1210en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000266330200006-
dc.citation.woscount7-
顯示於類別:期刊論文


文件中的檔案:

  1. 000266330200006.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。