晶圓廠投線的時排程研究

Abstract

在半導體晶圓製造廠中，最初端的矽晶圓投料排程是非常重要的決策課題，特別是在接單式生產的產業，因為所有的實體製造投線作業，皆需要根據客戶的訂單，接著才能進行後續的製造流程。過去文獻研究，大多著重在相對長時間的投線規劃，如討論一週內每日投線的作業維度。然而，為了達成更精確及有效的控管，本研究針對單日內每小時維度的投線決策作探討，使用多種單日情境進行模擬，並利用數據分析手法，提出適合產品特性與其組合的四種投料方式。實驗結果顯示，本研究新發展之適用於不同情境的『批次機台法』與『平均投線法』，優於另外現行典型之兩種『依序投料法』及『指定投線量法』。

Job scheduling in the wafer start area is a very important decision in semiconductor fabrication factories, in particular in a make-to-order scenario. All wafer starts need to be triggered by customized manufacturing orders. Many prior studies have investigated the job releasing decision on a relative longer time-bucket, for example, the daily job scheduling decision in a week. To get a more precise control, this study focuses on job hourly scheduling decision within one day. Four scheduling methods are proposed and justified by discrete-event simulation. Experiment results revel that the Batch Tool Method and the Average Dispatching Method outperformed the other two methods, which are typically used in industry.