IC設計業外包商評選之探討-以M公司為例

Abstract

半導體產業在企業激烈競爭之下，為因應品質改善、產能需求、新技術開發及成本不斷被壓低的狀況下，如何提升產業的競爭能力，成為各企業最主要的願景。尤其IC設計業者由以無製造產線為特色，在所有製程必須委外生產，其產品品質及市場競爭力均落在生產產品的外包商身上，故在選擇外包商生產的決策，成為現今IC設計業注重的課題之一。

本研究以記憶體IC設計業為探討對象，建構出評選IC測試及IC封裝外包商的準則，利用層級分析法，定義準則權重，評選出適當之外包商。期望該研究能有效的協助記憶體IC設計業管理後端外包商，讓IC設計業者在進行評選外包商時，有客觀及公正的評選方法。

Under the intense competition of semiconductor industry, how to improve the quality, capacity requirement, new technology development, and cost-down situation becomes the most important issues in the market. Especially, the feature of the IC design house is a fables industry, its manufacturing processes are outsourcing to subcontractors. The responsibility of product quality and market competition is controlled by subcontractor. Therefore to choose its subcontractors is the most important subject on IC design house.

This study is to develop the process for choosing an appropriate subcontractor. Firstly, we define the criteria to be considered in the determination of the subcontractors of IC testing house and IC assembly house for a memory IC design house. Secondly, based on the method of Analysis Hierarchy Process (AHP) we interview a number of managers to define the weights of these criteria for company M. Finally we analysis the survey results for some manager insights. We aim to assist the IC design house to manage the subcontractors by using this method, and make those industries have objective and impartial criteria under selection.