外引腳黏合設備之直角座標機器人動態分析與改善設計

Abstract

直角坐標機器人為面板產業的重要設備之一，被廣泛地運用在製程設備上，其中的核心設備─外引角黏合設備，負責顯示器與晶粒軟膜(Chip On Film)的黏合作業，讓驅動IC(Driver IC)與液晶顯示器(Liquid Crystal Display)的電路產生連結。然而隨著電路的尺寸進入了數個微米等級，外引角黏合設備在進行黏合過程時會產生壓合頭左右高速移動、上下壓合以及系統傳輸材料導致的振動問題，這些情況嚴重影響黏合時的精準度，已不容忽視。 本研究使用有限單元法進行外引角黏合設備之動態分析。主要目的為探討設備的基座結構在原料傳輸時，所產生的振動影響。以數值模擬的方式找出設備在動態下結構的振動問題，進而提出改善方法。 首先使用有限單元法軟體ANSYS，進行基座結構靜態、動態分析；接著透過雷射位移計和加速規量測設備的振動情況，藉以對有限單元模型進行比對以及修正；最後提出新的設計模型，顯示模擬下的改善程度。

Cartesian coordinate robots are one of the most important equipment in display industry, and are generally used for the manufacturing process. The core equipment - outer lead bonding equipment, is used to stick chip on films on the display, connecting the circuits with driver IC and liquid crystal displays. However, due to the scale of several micrometers in circuits, the vibration problems in the equipment caused by bonder motions, bonding process and material transports significantly affect the accuracy in sticking process, and they are no longer negligible. In this study, the finite element method is used for the dynamic analysis in outer lead bonding equipment. The goal is to investigate the vibration at the base structure of the equipment undergoing material transports. We propose improvements after finding out the vibration problems in dynamic response by numerical simulation. This study firstly uses a finite element software ANSYS to carry out the static and dynamic analyses of the base structure. The measurements of vibration are taken by laser sensor and accelerometer. The finite element model is in turn compared with measured results and modified. Finally, an improved design is proposed.