統計資料
總造訪次數
| 檢視 | |
|---|---|
| Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction | 125 |
本月總瀏覽
| 五月 2024 | 六月 2024 | 七月 2024 | 八月 2024 | 九月 2024 | 十月 2024 | 十一月 2024 | |
|---|---|---|---|---|---|---|---|
| Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction | 3 | 0 | 0 | 0 | 0 | 1 | 0 |
檔案下載
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| 000265086300070.pdf | 6 |
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