統計資料
總造訪次數
| 檢視 | |
|---|---|
| Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction | 126 |
本月總瀏覽
| 五月 2024 | 六月 2024 | 七月 2024 | 八月 2024 | 九月 2024 | 十月 2024 | 十一月 2024 | |
|---|---|---|---|---|---|---|---|
| Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction | 3 | 0 | 0 | 0 | 0 | 1 | 1 |
檔案下載
| 檢視 | |
|---|---|
| 000265086300070.pdf | 6 |
國家瀏覽排行
| 檢視 | |
|---|---|
| 中國 | 97 |
| 美國 | 26 |
| 愛爾蘭 | 1 |
| 印度 | 1 |
| 台灣 | 1 |
縣市瀏覽排行
| 檢視 | |
|---|---|
| Shenzhen | 93 |
| Menlo Park | 11 |
| Kensington | 8 |
| Beijing | 4 |
| Oakland | 3 |
| Dearborn | 1 |
| Edmond | 1 |
| Los Angeles | 1 |
| Mumbai | 1 |
| Saint Robert | 1 |