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dc.contributor.authorChen, Wei-Renen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorHsieh, Yen-Tingen_US
dc.contributor.authorChang, Chun-Yenen_US
dc.date.accessioned2014-12-08T15:09:49Z-
dc.date.available2014-12-08T15:09:49Z-
dc.date.issued2009-03-01en_US
dc.identifier.issn1536-125Xen_US
dc.identifier.urihttp://dx.doi.org/10.1109/TNANO.2008.2005728en_US
dc.identifier.urihttp://hdl.handle.net/11536/7517-
dc.description.abstractIn this study, the authors proposed a formation mechanism of Ge nanocrystals (NCs) embedded in the dielectric by using Si(1.33)Ge(0.67)O(2) and Si(2.67)Ge(1.33)N(2) films for nonvolatile memory (NVM) application. Because of internal competition reaction, this formation process reduced the thermal budget and eliminated the use of high-pressure H(2) treatment or steam process. The metal/oxide/insulator/oxide/silicon capacitor structure with NCs was also studied, and exhibited hysteresis characteristics after electrical operation. Transmission electron microscopy clearly shows the shape and density of NCs in the dielectric. In addition, the obvious memory window can be used to define "1" and "0" states at low-voltage program operation. Furthermore, good endurance and retention characteristics are exhibited for the Ge NCs embedded in SiN(x) structure. Besides, this technology is suitable for the current NVM fabrication and low-power device application.en_US
dc.language.isoen_USen_US
dc.titleFormation and Nonvolatile Memory Application of Ge Nanocrystals by Using Internal Competition Reaction of Si(1.33)Ge(0.67)O(2) and Si(2.67)Ge(1.33)N(2) Layersen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TNANO.2008.2005728en_US
dc.identifier.journalIEEE TRANSACTIONS ON NANOTECHNOLOGYen_US
dc.citation.volume8en_US
dc.citation.issue2en_US
dc.citation.spage185en_US
dc.citation.epage189en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
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